Home > Knowledge > Content
Low temperature heating process in EI grain oriented silicon steel lamination production
- Oct 18, 2018 -

In practical applications, reducing the heating temperature of the EI grain oriented silicon steel lamination slab is to avoid the formation of liquid slag, and also to reduce the maintenance of the furnace, to obtain a higher metal yield, and to prevent undesired grains in the middle of the slab. The advantages of coarsening.

  In recent years, in the study of low-temperature heating of EI grain-oriented silicon steel slabs, in addition to manganese sulfide, substances other than manganese sulfide, such as nitrides and grain boundary precipitation elements, have been added to enhance the inhibitor strength. Since it has been proved that the solid solution temperature of aluminum nitride is lower than that of manganese sulfide, it is more suitable for low temperature heating.  

 The method is to nitriding the steel to make it combine with the original elements in the steel to form an aluminum nitride precipitate having an inhibitor function. The slab heating temperature can be lowered to 1150 ~ 1200 ° C, in order to obtain a complete secondary recrystallized structure, high magnetic and good glass film, the corresponding composition adjustment and process improvement must be carried out.  

 The low-carbon 1.5% Mn-2.2% Si EI grain oriented silicon steel laminationprocess with aluminum nitride as an inhibitor reduces the slab heating temperature, mainly using aluminum nitride as the main inhibitor, Cu2S and manganese sulfide as auxiliary inhibitors. The slab is heated at 1250 ~ 1320 ° C to produce a general EI grain oriented silicon steel lamination process.http://www.chenglion.com/